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Glass Materials | Brands and Product Names

We offer a wide range of semiconductor-grade and optical-grade glass materials sourced from Japan, Germany, South Korea, and China, covering everything from standardized wafers to highly customized specialty glass.

Each material undergoes rigorous physical property testing to ensure outstanding optical and electrical performance, even in demanding operating environments.

(1) Quartz Glass

1-1. Fused Silica

  • Heraeus : Suprasil®

  • Corning : HPFS®

  • OHARA : Fused silica related grades

  • HOYA : Fused silica related grades

1-2. Fused Quartz

  • Feilihua：Fused quartz grades

  • Kaide Quartz：Fused quartz grades

  • Pacific Quartz：Fused quartz grades

1-3. Low OH Quartz Glass

  • Heraeus: Suprasil® low-OH grades

  • Corning: HPFS® low-OH grades

(2) Borosilicate Glass

Borosilicate Glass

SCHOTT : BOROFLOAT® 33 , TEMPAX®

Corning : PYREX® 7740

(3) Soda-Lime Glass

Soda-Lime Glass

  • SCHOTT Glaswerke AG: B270®

  • CSG : Float glass grades

  • Xinyi Glass : Ultra-clear / float glass grades

  • Kibing Glass : Soda-lime glass grades

(4) Sapphire

Sapphire

  • Kyocera 

  • Monocrystal : Sapphire substrates

  • TDG : Sapphire wafers

  • Crystal-Optech : Optical sapphire

JGS1 Deep UV Synthetic Fused Silica (SiO₂)

  • Diameter: 150 mm (6 in.)

  • Thickness: 150 µm ± 1 µm

  • Transmittance at 185 nm: 90% min.

  • TTV: < 1 µm

  • Scratch/Dig (S/D): 20/10 max.

  • DSP, double-side precision polished

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Application Examples

Clean Surfaces. Precision Cutting. Consistent Results.

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Cap Glass Wafer

  • Material: BOROFLOAT® 33

  • Surface Finish: Double-side polished

  • Diameter: 150 ± 0.2 mm

  • Thickness: 0.50 ± 0.05 mm

  • Orientation Flat Length: 47.5 ± 2.5 mm

  • Local Flatness: < 400 nm
    (measurement area: 2 mm × 2 mm)

  • Surface Roughness: < 3 nm

  • Scratch/Dig (S/D): 60/40 max.

  • Cap Size: Design value - 0.05 mm

  • Cap Edge Chipping: < 0.1 mm

  • Cap Pitch: 2.115 × 2.075 mm

  • Cap Depth: 0.2 ± 0.02 mm

  • Positional Accuracy

  • Offset between pattern center and wafer center: ± 0.25 mm

  • Alignment angle of cap pattern relative to orientation flat: ± 0.05°

  • Surface Quality

  • Scratches: 5 max.

  • Particles: 30 max.

  • Haze: None

  • Edge Chipping: None

  • Other Surface Defects: None

Customized Glass Processing
  • Diameter：400 ± 0.2 mm
  • Thickness：5 ± 0.01 mm
  • TTV < 3 µm
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Hole Glass Wafer

  • Material: BOROFLOAT® 33

  • Surface Finish: Double-side polished

  • Diameter: 152 ± 0.2 mm

  • Thickness: 0.8 ± 0.05 mm

  • Orientation Flat Length: 47.5 ± 2.5 mm

  • Edge Profile: C-edge

  • Local Flatness: < 400 nm
    (measurement area: 2 mm × 2 mm)

  • Surface Roughness: < 3 nm

  • Scratch/Dig (S/D): 60/40 max.

  • Hole Diameter: Φ0.50 ± 0.07 mm

  • Number of Holes: 3,078 or 6,096 (up to 1% defective holes allowed)

  • Hole Edge Chipping: < 0.1 mm

  • Hole Pitch

  • 3,078 holes: 2.115 × 2.075 mm

  • 6,096 holes: 1.500 × 1.500 mm

  • Positional Accuracy

  • Offset between hole array center and wafer center: ± 0.25 mm

  • Alignment angle of hole array relative to orientation flat: ± 0.5°

  • Surface Quality

  • Scratches: 5 max.

  • Particles: 30 max.

  • Haze: None

  • Edge Chipping: None

  • Other Surface Defects: None

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